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Next-Generation Silicones for Next-Level Computing Systems

 


In today’s fast paced world, no one has the time to deal with slow, unreliable computers and processing systems – and no one should have to.


Our broad portfolio of thermal materials can help you design more reliable computing systems with a lower total cost of ownership. With Dow Consumer Solutions by your side, you have the advanced materials and proven expertise needed to protect your valuable processors from rising operating temperatures and complete meltdowns.


Why silicones?


Silicone thermal materials, by nature, are stable under a wide range of operating temperatures and offer a broad choice of thermal conductivity.


Which silicones?


DOWSIL™ TC-5888 Thermally Conductive Compound is a one-part material that combines excellent thermal management for improved reliability, with a flow profile that enhances both productivity and precision.


Key Features and Benefits of DOWSIL TC-5888 Thermally Conductive Compound include:


●  One-Part Material: No cure is required when applying the material.

●  Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.

●  Thermal Stability: Delivers consistent performance and reliability under high temperatures.

●  Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.


References: https://www.dow.com/en-us/market/mkt-electronics/sub-elec-consumer-computer-comm/app-elec-consumer-computers.html