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DescriptionA one-part, 6.5W/mk thermal conductivity silicone gel. It’s printable or dispensable to cure as a soft thermal gel to replace fabricated thermal pads for thermal transferring, stress relieving and shock damping. Room temperature curing, or accelerated curing at 60°C or higher temperature for shorter curing time.
Durometer - Shore 00 50
20% Shelf Life
6.5 W/m・K Specific Gravity 3.45
7 E+13 Ω・cm
Telecom devices or equipment, e.g. optical transceivers, ethernet switches, routers, etc.
Datacom equipment, e.g. high speed solid-state disks (SSD)
High thermal conductivity (6.5W/mk);
Excellent extrusion rate (60 g/min) to support easy auto-dispensing process;
Resists humidity and other harsh environments without cracking and slumping;
Ultra low volatile content;
SDS / TDS
TDS DOWSIL™ TC-3065