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DescriptionLORD® CoolTherm™ 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Hardener Part B, Tan, 1 gal Pail.
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Product Details
Typical Use: Used for attaching semiconductors to heat sinks, or for applications where thermal conductivity and non-burning properties are required. Brand: CoolTherm Chemical Composition: Epoxy resin Color: Tan Components: 2 part Cure System: Room Temperature/Heat Cure Time: 24h @ Room Temperature; 2h @ 65 °C Dielectric Strength: 475 V/mil Elongation: 5% Flash Point: ≥93 °C Hardness: 75 D Specific Gravity: Part B: 1.55; Mixed: 1.57 Tensile Strength: 5000 psi Thermal Conductivity: 1 W/mK Viscosity: Part B: 14,000; Mixed: 12,000 Volume Resistivity: 1 x 10^16 ohm-cm -
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