Design engineers are being asked to pack more functionality into smaller, more powerful electronic devices, while at the same time, maintain high reliability performance through thermal cycling, shock, vibration, and mechanical stress. As component sizes shrink and performance demands increase, underfill and edge bond materials have become essential tools for improving assembly robustness and extending product life.

Design engineers are being asked to pack more functionality into smaller, more powerful electronic devices, while at the same time, maintain high reliability performance through thermal cycling, shock, vibration, and mechanical stress. As component sizes shrink and performance demands increase, underfill and edge bond materials have become essential tools for improving assembly robustness and extending product life.

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Conformal coatings are just one method of circuit board protection available to engineers. Those involved with PCBs may be familiar with the terms encapsulation. Encapsulation is a tremendously powerful method to secure and protect PCBs by submerging them in a protective material.

Shadowed or hard-to-reach areas beneath high-profile PCB components or high-density boards where a conformal coating may flow, and relative to light curing, may not be exposed to the curing light from above.