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DescriptionResinLab EP1290 Clear is a two component, room temperature and heat curing, unfilled epoxy that is used for bonding plastics and metals. It is semi-flexible, free flowing, has good air release and self leveling. It is resistant to salt solutions, water, impact, vibrations, organic and inorganic solvents. Part B, 5 gal Pail.
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Product Details
Typical Use: Designed for bonding metals and plastics. Chemical Composition: Epoxy Color: Clear Components: 2 part Cure System: Room Temperature/Heat Cure Time: 16 to 24h @ room temperature; 2h @ 65 °C; 20min @ 100 °C Dielectric Strength: 850 V/mil Elongation: 40% to 50% @ break Flash Point: >93 °C Hardness: 60 D Mix Ratio: 1:1 by volume; 1.22:1 by weight Service Temperature: -40 to 150 °C Shear Strength: 2,500 Specific Gravity: Part B: 0.99; Mixed: 1.08 Tensile Strength: 1,600 psi Thermal Conductivity: 0.14 W/mK Viscosity: Part B: 7,500; Mixed: 30,000 Volume Resistivity: 5 x 10^12 ohm-cm Working Time: >2h -
Ellsworth Adhesives Insights
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