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Ellsworth Adhesives - Home>Products>Encapsulants>Silicone>Dow DOWSIL™ EE-3200 Silicone Encapsulant Part A Off-White 0.5 kg Jar
  • Dow DOWSIL™ EE-3200 Silicone Encapsulant Part A Off-White 0.5 kg Jar
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Part number: EE-3200 PART A .5KG Manufacturer SKU: 4121014
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
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  • Description
    Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part A, 0.5 kg Jar.
  • Product Details
    Typical Use:Used as a low stress encapsulant to lessen internal stress generation, improve manufacturing speed, and fill small gaps on electronic devices. EE-3200 can be used on automotive electronics modules, junction boxes, and power conversion devices.
    Brand:DOWSIL
    Chemical Composition:Polydimethylsiloxane
    Color:Off-White
    Components:2 part
    Cure System:Room Temperature/Heat
    Cure Time:3h @ 25 °C; 20min @ 50 °C
    Dielectric Strength:350 V/m
    Elongation:340%
    Flash Point:>101.1 °C
    Hardness:20 OO
    Mix Ratio:1:1
    Specific Gravity:1.48
    Tensile Strength:33 psi
    Thermal Conductivity:0.5 W/mK
    Viscosity:1,400
    Volume Resistivity:1e + 15 ohm-cm
    Working Time:30min @ 25 °C

     

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