Part number: EP691 CLEAR 50MLManufacturer SKU:
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DescriptionResinLab EP691 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
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Product Details
Typical Use: Designed for medium sized castings requiring good clarity. Chemical Composition: Epoxy Color: Clear Components: 2 part Cure System: Room Temperature/Heat Cure Time: 24h @ room temperature; 1h @ 65 °C; 20min @ 100 °C Dielectric Strength: 410 V/mil Elongation: 4% to 9% @ break Flash Point: Part A: 252 °C; Part B: >260 °C Hardness: 80 D Mix Ratio: 2:1 by volume; 100:45 by weight Service Temperature: -40 to 121 °C Specific Gravity: Mixed: 1.11 Tensile Strength: 8,500 psi Thermal Conductivity: 0.14 W/mK Viscosity: Mixed: 9,000 Volume Resistivity: 8 x 10^14 ohm-cm Working Time: >2h -
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