Part number: SEC1233 4MLManufacturer SKU:
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DescriptionResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 mL Dual Syringe.
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Product Details
Typical Use: Resinlab SEC1233 provides excellent electrical conductivity useful in many electronic applications. Chemical Composition: Epoxy Color: Silver Components: 2 part Cure System: Room Temperature/Heat Cure Time: 24 to 72h @ 25 °C; 1h @ 60 °C Elongation: 20% to 30% @ break Flash Point: Part A: >93 °C; Part B: 100 °C Hardness: 70 D Mix Ratio: 1:1 by weight Service Temperature: -40 to 150 °C Shear Strength: 600 Specific Gravity: Mixed: 3.9; Part A: 3.88; Part B: 3.97 Tensile Strength: 450 psi Thermal Conductivity: 4.65 W/mK Viscosity: Mixed: 29,500 to 582,000 Volume Resistivity: 0.0016 ohm-cm Working Time: 60min -
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SDS / TDS
