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Ellsworth Adhesives - Home>Products>Specialty Chemicals>Gasket>Resin Designs Gap Filler Thermal Pads TP-2101
  • Resin Designs Gap Filler Thermal Pads TP-2101
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Part number: TP-2101Manufacturer SKU:
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  • Description
    Resin Designs TP-2101 Thermal Gap Pad is a cost-competitive, highly compressible, silicone gap filler with moderate bulk conductivity. This filler uses foam reinforcement to maintain compressibility, while providing easy handling to simplify application and improve long-term reliability. It is ideal for use in low-power applications requiring heat transfer across any large airgap.
  • Product Details
    Tacky2 side
    Hardness,Shore 0070 max
    Compressio n Deflecti on at 20% psi21.3
    Specific Gravity1.82
    Thermal Conductivity W/m°k,min0.73
    Tear Strength,0.5mm.thickness lb./in-
    Weight Loss,after 336 hr.at 150°C,%1 max
    Volume Resistivity10 EXP 11 min
    UL 94 Rating/Cert File # QMFZ2.E177248

    Thickness(mm):1.5-4.0 UV94:V1

    Thickness(mm):4.6-5.3 UV94:V0

    StorageBecause these are precured materials, there is no special storage condition or usage date required. The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.
    Applications

    Switching devices

    Automatic power boards

    Microinverters


  • SDS / TDS

    TDS     TP-2101